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Overview
Multispectral Imaging is
always interested in hearing from experienced and highly qualified
engineers and engineering managers with experience in uncooled
infrared detector and camera manufacturing. MII offers
exciting career growth opportunities in a small privately held
rapidly growing company that highly values the contributions from
each of its employees. Some of these openings might require U.
S. citizenship or permanent residency status.
Email or fax your resume and let us explore the opportunities
together.
POSITIONS AVAILABLE
Test Engineer
MII is seeking a test engineer to support MEMS prototyping
activities with company employees at the Cornell NanoScale Science &
Technology Facility (CNF) in Ithaca, New York. This engineer will be
responsible for the design and analysis of optical and electronic
measurements required for the characterization of fabricated
devices. Specific responsibilities include:
1. Validation of wafer lot
functionality
Setup / maintenance of electronic test setup required to
perform device electrical measurements
Wirebonding / packaging of representative CMOS MEMS devices
(with / without TEC)
Testing for electrical functionality to validate MEMS run /
lot
Diagnosis of reasons for run failure / changes from electrical
testing
2. Extraction of MEMS parameters
Perform electrical measurements to extract parameters such as
yield, paddle heights, TCC, temperature sensitivity, etc.
Perform die level measurement of some of the above parameters
using optical measurements
The following skills and experience are required:
A Bachelors degree in science or engineering.
Familiarity with design and development of tests and test
plans, testing, and debugging of analog and digital sensor
systems.
Good working knowledge of electronics and test equipment such
as power supplies, function generators, spectrum
analyzers, etc.
Excellent hands-on skills for basic electronics tasks, with
the ability to learn new skills.
Good working knowledge of software such as Excel and
Powerpoint with the ability to chart data. C / Matlab
programming
experience preferred.
Excellent teamwork, communications, and documentation skills.
Thermal Imaging
Applications Engineer
Multispectral Imaging Inc., with headquarters in Parsippany, New
Jersey, is seeking a thermal imaging applications engineer to join a
small entrepreneurial team developing new thermal infrared sensing
technology using MEMS/MOEMS technology. The candidates primary
responsibilities will include:
The integration, testing, and
optimization of thermal imaging subsystems including focal plane
arrays, readout
integrated circuits, and camera control/video
output electronics.
Oversight of the company's integration and test laboratory.
Specification of components required for development and
preproduction subsystems.
The successful candidate will have
a B.S. degree (M.S. preferred) in Electrical Engineering with 5-10
years of relevant experience. Specific requirements include:
Extensive knowledge of readout
integrated circuits and camera control/video output electronics.
Demonstrated experience in the optimization of focal plane
array and camera electronics.
Hands-on experience in testing and qualification of infrared
imaging systems.
Experience with optical bench setup, measurement, and test.
Facility with laboratory data acquisition and instrument
control software, including Matlab and Agilent Vee.
Facility with image analysis software tools.
Extensive knowledge of vanadium oxide microbolometer focal
plane arrays, including signal and noise performance and
electronic interface issues is desirable.
Candidates interested in
these positions should submit a resume and letter of interest to:
Dr. Gregory S. Maurer
VP of Engineering
Multispectral Imaging, Inc.
100 Misty Lane
Parsippany, NJ 07054
gmaurer@multispectral.net
Telephone: 973-515-7340
Fax: 973-515-7350
Modeling
Scientist or Engineer
Multispectral Imaging, with headquarters in Parsippany New Jersey
and a branch office in Oak Ridge Tennessee, is seeking a modeling
scientist or engineer to join a small entrepreneurial team of
scientists and engineers developing a new thermal infrared sensing
technology using MEMS/MOEMS technology. The present position
requires the applicant to work out of the Oak Ridge office.
The candidates responsibilities will include:
The design, simulation
and performance optimization of highly innovative
micromechanical sensors structures for use in
1D and 2D sensor arrays for use as thermal infrared sensors and detector
arrays.
Modeling the thermal, optical, electrical and mechanical
interactions and properties of the materials and sensor
structures.
Modeling the interaction of the capacitively sensed MEMS
sensor structures with the CMOS electronic readout and control
circuits.
Familiarity with laboratory data acquisition and instrument
control and laboratory measurement techniques would be
desirable.
The successful candidate
will have an M.S. or Ph.D. in electrical engineering or physics with
preferably 2-5 years post graduate experience in sensor design and
modeling. Recent graduates with appropriate skills obtained
during a research project will also be considered. Specific
requirements include:
Experience with
appropriate modeling and simulation tools such as Ansys, Comsol,
Matlab, VisSim, etc.
Experience with heat flow analyses, mechanical design and
stress analysis in thin film structures.
Experience in the design and modeling of capacitive sensing
devices.
Candidates interested in
this position should submit a resume and letter of interest to:
Dr. Scott R. Hunter
Chief Technology Officer
Multispectral Imaging, Inc.
Suite A
1020 Commerce park Drive,
Oak Ridge, TN 37830
shunter@multispectral.net
Telephone:
865-482-0230
Fax:
865-220-2030
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